The largest packaging and test firms are growing fast: ASE's assembly and test revenue rose 51% in the third quarter of 2026, and Amkor earned 82.8% of 2025 sales from advanced products.
Why this market is moving now
- Assembly and packaging equipment sales rose 21% in 2025 as chipmakers moved to advanced packaging for AI chips.
- ASE lifted its 2026 leading-edge packaging revenue outlook to over 4 billion US dollars in October 2026.
- Packaging firms are spending more: ASE raised its 2026 capital plan to 11.5 billion US dollars.
- Amkor plans 2026 capital spending of up to USD 3.0 billion, mainly for a new plant in Arizona.
Key figures
Global figures for this market, with the year each one describes. Use Cite to copy a reference to this page.
| Figure | Value | Year | Cite |
|---|---|---|---|
| Worldwide sales of semiconductor assembly and packaging equipment rose 21% in 2025 as adoption of advanced packaging expanded. | 21 % year on year | 2025 | |
| Global sales of semiconductor test equipment rose 55% in 2025, driven by AI chips and high-bandwidth memory, and total chip equipment sales reached a record USD 135.1 billion. | 55 % year on year | 2025 | |
| Amkor, the largest US-headquartered packaging and test provider, made USD 5,556 million from advanced packaging products in 2025, 82.8% of its USD 6,708 million net sales. | 5556 USD million | 2025 | |
| Amkor had net sales of about USD 3,080 million from advanced system-in-package modules in 2025. | 3080 USD million | 2025 | |
| Amkor's net sales rose 25.6% to USD 1,898.0 million in the second quarter of 2026, with growth in all end markets. | 1898.0 USD million | 2026 | |
| Amkor expects capital spending of about USD 2.5 billion to USD 3.0 billion in 2026, mainly for its new Arizona packaging plant. | 3.0 USD billion | 2026 | |
| ASE, the leading provider of semiconductor assembly and testing services, had assembly and test revenue of NT$151,485 million in the third quarter of 2026, up 51.0% on a year earlier. | 151485 NT$ million | 2026 | |
| ASE raised its expected 2026 revenue from leading-edge advanced packaging (LEAP) services from 3.7 billion to over 4 billion US dollars. | 4 USD billion | 2026 | |
| ASE raised its 2026 capital spending plan from 10.5 billion to 11.5 billion US dollars, with 60% of the added equipment spend going to leading-edge advanced packaging. | 11.5 USD billion | 2026 | |
| ASE spent USD 2.1 billion on machinery and equipment in the third quarter of 2026, of which USD 1.0 billion went to packaging operations. | 2.1 USD billion | 2026 |
Calculated figures (shares, changes and prices per kilogram) are plain arithmetic on the reported values. Read how we work.
Companies to watch
ASE Technology Holding
Leading provider of chip assembly and test services; third quarter 2026 assembly and test revenue rose 51.0% year on year.
Amkor Technology
Largest US-headquartered packaging and test provider; advanced products were 82.8% of its 2025 net sales.
TSMC
Chip foundry that also sells advanced packaging services such as CoWoS and SoIC.
What the full report covers
- 01Executive summary
The answer in one page: size, direction and what moves it - 02Market definition and scope
What is in and out of the global market - 03Global market size, 2021 to 2025
Historical series and growth rates - 04Countries and regions
Demand, supply and trade by country and region - 05Outlook to 2031
Base, low and high scenarios with stated assumptions - 06Rules, policy and deadlines
Regulation and programmes that change demand - 07Drivers and barriers
What accelerates or slows adoption, by customer segment - 08Prices, costs and margins
Unit economics where public data allows - 09Competitive landscape
8 to 12 company profiles with recent moves - 10Opportunities and risks
For new entrants, suppliers and investors - 11Method and assumptions
How every figure was built
Included with the full report
- PDF report, 40 to 60 pages
- Excel data pack
- Ready-to-use charts
- Method note and assumptions
- Written to order in 5 working days
Frequently asked questions
How fast is the global advanced semiconductor packaging market growing?
Worldwide sales of assembly and packaging equipment rose 21% in 2025 as advanced packaging spread. Sales of chip test equipment rose 55%, driven by AI chips and high-bandwidth memory.
Who are the largest semiconductor packaging companies?
ASE is the leading provider of chip assembly and test services. Amkor is the largest US-headquartered provider. ASE's assembly and test revenue rose 51.0% in the third quarter of 2026.
How much revenue does advanced packaging bring Amkor?
Amkor made USD 5,556 million from advanced products in 2025, 82.8% of its USD 6,708 million net sales, up from USD 5,033 million in 2023.
How much is ASE earning from leading-edge advanced packaging?
ASE expects over 4 billion US dollars of leading-edge advanced packaging revenue in 2026, up from the 3.7 billion it guided a quarter earlier.
How much are packaging companies investing?
ASE raised its 2026 capital plan from 10.5 billion to 11.5 billion US dollars. Amkor expects 2026 capital spending of about USD 2.5 billion to USD 3.0 billion, mainly for its Arizona plant.
How big was the chip equipment market in 2025?
Worldwide chip equipment sales reached a record USD 135.1 billion in 2025. Within that, assembly and packaging equipment sales grew 21%.
Free sample
Get a free sample of this report
We send the table of contents, two sample chapters and the method note, usually within one working day. It is free to ask.
- Full table of contents
- Two sample chapters
- Method note and data outline